Cho-Bond 1038
Product Description
CHO-BOND 1038 is a silver-plated copper filled, one-component conductive silicone designed for EMI shielding and electrical grounding. It’s used as a fillet, gap filler, and seam sealant on electrical enclosures and provides a robust conductive and environmental seal.
This moisture-cure silicone polymer system allows it to cure to the touch in 24 hours, with full cure achieved in one week. It has a 30-minute working life and requires no pressure during curing. The product is a non-corrosive cure mechanism, meaning no corrosive by-products are generated during curing, which could damage the substrate.
- One-part
- Silver plated
- copper filled
- Silicone binder
- Non-Corrosive
- Easy to use
- Highly conductive
Additional Info
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