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ChO-BOND 1035 with Primer 1086

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  • Convenient and Easy to Use.
  • Cost-Effective Conductivity: Provides good electrical conductivity (0.050 Ω·cm) at a low cost.
  • Corrosion-Free: No corrosive by-products are generated during the curing process.
  • Lightweight: Minimal weight is added to the assembly, making it suitable for weight-sensitive applications.
  • Effortless Application: Thin paste consistency allows for easy dispensing, application, and spreading.
  • Low-Pressure Curing: Achieves a strong bond without requiring pressure during the curing process.

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SKU: CH5707 Category: Tags: , Brand:

Description

CHO-BOND 1035 with Primer 1086 is a lightweight silver-plated glass-filled silicone sealant system for EMI shielding and environmental sealing. It provides good electrical conductivity with a volume resistivity of 0.050 Ω·cm. The system includes an air-drying primer that enhances adhesion. The sealant is supplied as a thin paste, and once applied, it skins in 30 minutes and fully cures in one week. The cured material is flexible and operates from -55 °C to 200 °C. It is ideal for portable electronics, radar systems, and military applications.

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