BERGQUIST SIL PAD TSP 1600S

BERGQUIST® SIL PAD® TSP 1600S is a silicone-based, pink thermal interface material. Designed for thermally conductive and electrically insulating, general-purpose applications offering a 1.6 W/m-K thermal conductivity.

Built with a fiberglass reinforcement carrier which provides excellent resistance to tear and puncture while maintaining a flame rating of UL 94 V-0. This construction features a smooth and highly compliant surface designed to minimize interfacial thermal resistance even under low mounting pressures, ensuring high thermal performance across a wide operating temperature range of -60°C to 180°C.

Typical applications include power supplies, automotive electronics, motor controls, and power semiconductors. It is specifically optimized for discrete semiconductors (such as TO-220 and TO-247) mounted with spring clips, where clamping forces are limited but consistent thermal contact is required.