Bond Ply

Bond Ply is a versatile thermal management solution, that excels at conducting heat transfer while providing excellent electrical insulation. The material is available in PSA (Pressure Sensitive Adhesive) or laminating formats. Bond-Ply effectively decouples bonded materials with differing thermal expansion properties. Applications for Bond-Ply include attaching a heat sink to GPUs, power converter PCBs and drive processors. Benefits of this material are that it can immediately bond with the target surface, when this material is repeatedly exposed to an elevated temperature the bond strength increases over time giving it an excellent dielectric barrier. Bond-Ply removes the need to use materials such as screws, clip mounts and fasteners.