Description
BERGQUIST BOND PLY TBP 850 is a double-sided, thermally conductive tape that simplifies thermal management for electronics. It efficiently transfers heat away from components, keeping them cool. This strong, pressure-sensitive tape bonds easily to various surfaces, eliminating messy pastes and complex mounting. Available in different thicknesses, BOND PLY TBP 850 offers a cost-effective and user-friendly solution for diverse thermal applications.
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