Gap pad tgp500

Product Spotlight – BERGQUIST GAP PAD TGP 5000

Todays #ProductSpotlight focuses in on @Henkels product BERGQUIST GAP PAD TGP 5000!

The BERGQUIST GAP PAD TGP 5000 is a unique gap filling material that combines impressive thermal performance with user-friendly features such as withstanding pulling and ripping for a durable and reliable application and it also efficiently transfers heat away from hot components, keeping your electronics cool.

Features and Benefits:

  • High Thermal Conductivity: 5.0 W/m-K
  • Highly conformable, “S-Class” softness
  • Natural inherent tack reduces interfacial thermal resistance
  • Conforms to demanding contours and maintains structural integrity with little or no stress applied to fragile component leads
  • Fiberglass reinforced for puncture, shear and tear resistance
  • Excellent thermal performance at low pressures

#Henkel #channelpartners #protectingyourelectronics