BERGQUIST SIL PAD TSP Q2500

BERGQUIST SIL PAD TSP Q2500 is a high-performance foil-format interface designed to replace messy thermal grease in applications where maximum heat transfer is the priority. This composite consists of an aluminium foil core coated on both sides with thermally and electrically conductive Sil-Pad rubber. By providing a thermal impedance of just 0.22°C-in²/W at 50 psi, it ensures optimal contact between surfaces, effectively dissipating heat from transistors, resistors, and power modules to their respective heat sinks or chassis.
Because it is a dry, solid-state solution, TSP Q2500 eliminates the risks of contamination often found with liquid compounds, such as the fouling of reflow solder baths or the collection of dust that can lead to surface shorting. The material can be installed prior to cleaning and soldering operations, significantly streamlining the assembly process. Available in sheets, rolls, or die-cut parts, it is a superior choice for large-surface interfaces where electrical isolation is not required but thermal efficiency is critical.