Phase Change Materials
Phase Change Materials (PCMs) are dry, thin pads that are placed in between a heatsink or component surface. Upon reaching the required melting temperature, the pad will fully change phase into a liquid to achieve maximum surface wetting for better thermal performance.
Hi-Flow THF 500
Hi-Flow THF 700 UT
(Hi-Flow 225 UT)
Hi-Flow THF 900
Hi-Flow 1000 F AC
(Hi-Flow 225 F AC)
Hi-Flow THF 1500 P
(Hi-Flow 650 P)
Hi-Flow THF 1600 P
(Hi-Flow 300 P)
Hi-Flow THF 3000 UT
(Hi-Flow 565 UT)
Parker Chomerics Phase Change Materials
Bergquist Phase Change Materials
Parker Chomerics Thermflow Phase Change Thermal Interface Materials (TIMs) completely fill interfacial air gaps and voids. They also displace entrapped air between power dissipating electronic components. Phase Change Materials are designed to maximize heat sink performance and improve component reliability.
Low thermal impedance
Proven solution – years of production use in personal computer OEM applications
Demonstrated reliability through thermal cycling and accelerated age testing
Thermflow Non-Silicone, Phase-Change Thermal Interface Pads
Can be pre-applied to heat sinks
Protective release liner prevents contamination of material prior to final component assembly
Tabs available for easy removal of release liner (T710, T725*, T557, T777, PC07DM) * T725 is only offered with a tab
Available in custom die-cut shapes, kiss-cut on rolls
Frequently Asked Questions
Does the material flow out when operational?
Material may flow when oriented vertically, especially at higher temperatures. This does not affect thermal performance, but should be considered if appearance is important.
Can Phase Change materials be removed?
Yes, heated up to 40°C and snapped apart with a sharp blade. Please note, Thermflow pads soften as they reach component operating temperatures.
What should a bonding surface be cleaned with?
IPA or MEK, essentially dust free.
Are Phase Change materials electrically isolating?
Standard Thermflow products are electrically non-conductive, however metal-to-metal contact is possible after the material undergoes phase change, decreasing their electrical isolation properties. PC07DM-7 is the only Thermflow material recommended for use as a dielectric insulator.