Commercial Paints

Commercial Compounds and Paints

The compound and paints supplied by HITEK for EMC shielding come from Chomerics, one of the world leaders in EMC shielding solutions. These compounds include conductive adhesives and caulks, as well and inks and paints. They can be used for attaching conductive gaskets, bonding seams, caulking joints, coating non-conductive substrates and protecting galvanically incompatible metals.

If you need help with your application please contact HITEK Electronic Materials Ltd alternatively fill in the EMC questionnaire.

Some specific products are listed below.

Cho-bond 1035  is a one-part silver plated glass filled silicone RTV sealant used for bonding commercial conductive elastomers such as the Cho-Seal 1350 and Cho-Seal 1356, or for sealing joints. It does not require pressure during cure to produce a conductive joint.

Cho-bond 584-29  is a two-part conductive epoxy that has been used for the permanent bonding of metals and the repair of heating circuits. The filler is pure silver and the materials comes in small bi-packs know as Cho-packs. Cho-packs come in sizes as small as 1g up to 10g. The material can also be purchased in bulk.

Cho-Shield 610  is a two-part epoxy coating that can be used for the protection of steel, plastics and composites. It is a high performance silver plated copper filled material that was developed to meet the requirements of both military and high end commercial applications such as medical electronics.

Cho-Shield 2052  - Commercial grade silver plated copper filled acrylic coating designed for high-performance and adhesion to plastic substrates typical shielding levels of over 60db can be achieved. Compatible with plastics such as polycarbonate, pc-abs and pvc.

Cho-Shield 2054  - water-borne version of 2052

Cho-Shield 2056  - similar to 2052 but designed for high volume applications offering high performance with thinner a coating thickness resulting in reduced costs.

Please contact HITEK Electronic Materials Ltd for applications involving low volumes as minimum order volumes may apply.