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+44(0)1724 851678


Outstanding thermal performance in an insulated pad

HI FLOW THF 1600P is now supported by HITEK. It is a thermally conductive 55°C phase change compound coated on a thermally conductive polyimide film. The polyimide reinforcement makes the material easy to handle and the 55°C phase change temperature minimizes shipping and handling problems. The product is supplied on an easy release liner for exceptional handling in high volume manual assemblies. This product is designed for use as a thermal interface material between electronic power devices requiring electrical isolation to the heat sink. The use of spring clips to assure constant pressure with the interface and power source is recommended.

Features & Benefits

• Thermal impedance: 0.13°C-in2/W (@25 psi)
• Field-proven polyimide film
• Excellent dielectric performance
• Excellent cut-through resistance
• Outstanding thermal performance in an insulated pad

Typical Applications include:

Spring clip mounted devices and discrete power semiconductors and modules. 

For the full datasheet on this product please see the downloads section below and if you need any more information on the product please contact HITEK on +44 (0)1724 851678



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