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HITEK supplies the Henkel range of Thermally Conductive Adhesives. The Bond-Ply and Liqui-Bond range of materials allow adhesion of a heat sink to a wide range of substrates and remove the need for mechanical fasteners such as screw mounting and clip mounting. As well providing high thermally conductive and electrically isolation, they can reduce stress caused by vibration, shock and thermal expansion. Thermally conductive adhesives are utilised for the decoupling of bonded materials with mismatched thermal coefficients of expansion.
Henkel's Thermal Adhesive range is listed below:
Henkel's Thermally Conductive Adhesives can be used for both industrial and consumer applications in the following industries: automotive electronics, computer, storage and gaming, datacomm infrastructure, aerospace, handheld and tablets, home appliances, lighting equipment, medical and instrumentation and power and industrial automation.
The BOND-PLY range of materials are thermally conductive and electrically isolating. BOND-PLY is available in a PSA or laminating format. BOND-PLY provides for the decoupling of bonded materials with mismatched thermal coefficients of expansion. BOND-PLY provides:
When there is a requirement for bonding large areas or complex parts together, thermal adhesive films are recommended. Larger bonding areas are problematic for liquid-based mediums as voids may result; films, however, deliver uniform, void-free bondlines and controlled thicknesses. Supplied in custom, pre-cut formats, the product line of thermal adhesive films offers a clean, waste-free, easily-processed solution with a low total, cost of ownership in thermally and electrically-conductive formulas.
Henkel’s liquid adhesives provide robust mechanical attachment, allowing for the removal of fasteners such as screws and clips, which also helps reduce device size and weight. These form-in-place elastomers are ideal for coupling “hot” electronic components mounted on PC boards with an adjacent metal case or heat sink, with the ability to maintain thin bond lines and excellent thermal paths.