BERGQUIST SIL PAD TSP 1800

BERGQUIST SIL PAD TSP 1800 is a premium, silicone-based material featuring a smooth and highly compliant surface. Reinforced with glass fibre for superior cut-through resistance, it is specifically designed for applications where electrical isolation is critical, and mounting is achieved via screws or clips. The material excels across a wide pressure range, providing exceptional thermal performance (0.53°C-in²/W at 50 psi) by ensuring maximum surface contact even at lower application pressures.

Both sides of the pad are non-tacky, which allows for easy re-positioning during assembly and helps reduce production errors. This smooth finish also contributes to superior breakdown voltage and surface “wet-out” values, which are vital for automotive control modules, motor controls, and audio amplifiers.

Whether used for discrete devices or sophisticated telecommunications hardware, TSP 1800 offers a durable and high-performing interface that maintains stable thermal and electrical properties between -60°C and 180°C.