BERGQUIST SIL PAD TSP 3500

BERGQUIST® SIL PAD® TSP 3500 is a white, silicone-based thermal interface solution engineered for demanding electronic packaging applications. By utilising a specialised filler/binder matrix, it achieves a thermal conductivity of 3.5 W/m-K, ensuring a superior balance between efficient heat transfer and dielectric integrity.

The pad incorporates a glass fibre reinforcement carrier that offers excellent resistance to physical damage while remaining conformable and grease-free. This robust construction enables the product to meet stringent electrical requirements, featuring a dielectric breakdown voltage of 4,000 Vac and a UL 94 V-0 flammability rating. Furthermore, the design is specifically tuned to minimise thermal impedance—reaching as low as 0.33°C-in²/W at 50 psi—to guarantee effective heat dissipation even in high-stress environments.

Typical applications include power supplies, motor controls, power semiconductors, and sophisticated aerospace or avionics systems.