BERGQUIST GAP PAD TGP 1500

BERGQUIST GAP PAD TGP 1500 is a thermally conductive, un-reinforced gap-filling solution that provides a conductivity of 1.5 W/m-K. By utilising a specialised filler blend, the material maintains a low-modulus characteristic that ensures the pad is both soft and pliable. The un-reinforced construction allows for maximum compliancy, enabling the product to adapt effortlessly to the surface of components while remaining robust enough for convenient handling during the assembly process.
The material features a natural tack on both sides, which allows it to conform tightly to adjacent surfaces and significantly reduce interfacial resistance. In addition to its thermal performance, TGP 1500 is electrically isolating, making it a reliable choice for high-density electronic packaging where short-circuits must be prevented. Its ability to operate across a wide temperature range, of -60°C to 200°C, ensures stable heat dissipation in various environmental conditions.
Typical applications include power conversion, telecommunications, and computer peripherals, as well as RDRAM™ memory modules and chip-scale packages. It is particularly effective in areas where heat needs to be transferred to a frame, chassis, or other types of heat spreaders. Available in thicknesses from 0.508mm to 5.08mm, it provides a versatile and user-friendly interface for cooling hot components and maintaining overall system reliability.