BERGQUIST GAP PAD TGP 800VO

BERGQUIST GAP PAD TGP 800VO offers a cost-effective solution for thermal management in electronic devices, by providing a reliable thermal conductivity of 0.8 W/m-K.
The material consists of a specialised filled polymer supplied on a rubber-coated glass fibre carrier, a construction that significantly improves puncture and tear resistance while ensuring the pad remains easy to handle during high-volume assembly. Its conformable properties allow it to fill air voids between PCBs and heat sinks efficiently.
In addition to its thermal capabilities, TGP 800VO is electrically isolating, making it suitable for a wide range of applications including power conversion, telecommunications, and computer peripherals. It is particularly effective when used between heat-generating semiconductors or magnetic components and a heat spreader or chassis.