BERGQUIST GAP PAD TGP 1500R

BERGQUIST GAP PAD TGP 1500R incorporates a glass fibre reinforcement carrier to enhance mechanical durability. This reinforcement makes the material significantly easier to handle during assembly while providing superior resistance to punctures, tears, and shearing. Despite this added strength, it retains the same highly conformable, low-modulus polymer base, ensuring it remains an ideal solution for filling gaps between delicate components and their respective cooling hardware.
TGP 1500R is rated with a thermal conductivity of 1.5 W/m-K and features an inherent natural tack on both sides. This ensures excellent compliance with mating surfaces, effectively minimising interfacial resistance to maximise heat transfer efficiency. Furthermore, TGP 1500R is electrically isolating and features an easy-release construction that streamlines the manufacturing process. With an operating temperature range of -60°C to 200°C, it provides a stable and reliable thermal interface for high-stress environments.
Typical applications include power conversion, telecommunications hardware, and computer peripherals, as well as RDRAM™ memory modules and chip-scale packages. It is particularly effective in designs where heat must be transferred to a frame, chassis, or other type of heat spreader without risking electrical contact. Available in thicknesses ranging from 0.254mm to 0.508mm, this reinforced gap filler offers a balanced combination of physical robustness and thermal sensitivity.