BERGQUIST GAP PAD TGP 1350

BERGQUIST GAP PAD TGP 1350 is a highly conformable gap-filling solution specifically developed for use with fragile component leads and delicate electronics. Featuring a thermal conductivity of 1.3 W/m-K, it incorporates a unique PEN reinforcement film that improves puncture resistance and handling while facilitating easy rework if required. The material is exceptionally soft, allowing it to adapt to uneven surfaces and high-roughness topographies to provide excellent “wet-out” and heat transfer with minimal mounting strain.

The inherent tack on one side of the pad ensures secure placement without the need for additional adhesive layers that might otherwise impede thermal efficiency. While the PEN film is designed to be left intact to aid durability, its presence does not significantly impact the product’s cooling capabilities.

Ideally suited for LED lighting, telecommunications, and computer peripherals, TGP 1350 is available in various thicknesses and configurations, including sheet form and custom die-cut parts, to meet specific engineering needs.