BERGQUIST GAP PAD TGP 1000VOUS

BERGQUIST GAP PAD TGP 1000VOUS is an ultra-conformable, gel-like interfacing material designed to fill air gaps while providing essential electrical insulation. With a thermal conductivity of 1.0 W/m-K, its viscoelastic nature is particularly effective at absorbing shocks and dampening vibrations, making it a valuable tool for protecting sensitive devices from environmental stress.

The pre-cured format is user-friendly and specifically engineered to be resistant to punctures, shears, and tears.

TGP 1000VOUS is highly recommended for situations requiring minimal assembly force, as its soft modulus significantly decreases the strain placed on components and boards.

Its insulating properties allow for safe use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

Whether utilised in telecommunications, computer peripherals, or power conversion, TGP 1000VOUS offers a versatile and durable solution for any assembly where heat needs to be transferred to a frame or heat spreader.