BERGQUIST SIL PAD TSP Q2000

BERGQUIST SIL PAD TSP Q2000 serves as a glass-reinforced, grease replacement designed to bridge the gap between heat-generating components and cooling hardware without the processing constraints of traditional pastes. The elastomer construction allows the pad to conform effortlessly to surface textures, creating an air-free interface that achieves a thermal impedance of 0.35°C-in²/W at 50 psi. This reinforcement enables the material to withstand significant processing stresses, ensuring it retains its physical integrity throughout the life of the assembly.
One of the primary benefits of TSP Q2000 is its compatibility with standard manufacturing workflows; it can be installed prior to soldering and cleaning without the risk of contaminating electronic assemblies. It is an ideal solution for use under electrically isolated power modules, transformers, and solid-state relays. By providing a clean, easy-to-handle format that maintains excellent surface “wet-out,” it ensures reliable heat dissipation while reducing the risk of assembly errors in high-volume production environments.