BERGQUIST GAP PAD TGP HC3000

BERGQUIST GAP PAD TGP HC3000 is a thermal interface material specifically engineered for applications where delicate components require a gentle touch. This soft, low-modulus solution delivers a thermal conductivity of 3.0 W/m-K, ensuring impressive cooling performance even at low assembly pressures. Its conformable nature allows for quick reshaping and excellent “wet-out” characteristics, enabling the pad to adapt seamlessly to irregular topographies or surfaces with high roughness.
To enhance durability and handling, TGP HC3000 is reinforced with a glass fibre carrier. This provides a resistance to shear and tearing forces. It features inherent natural tack on both sides, which simplifies the assembly process by allowing “stick-in-place” positioning without the need for thermally impeding adhesive.
This gap pad is ideally suited for telecommunications, ASICs, and consumer electronics, TGP HC3000 effectively bridges the gap between thermal modules and heat sinks while minimising mechanical stress on the board and its components.