Technomelt PA 657 Black (20kg)

Technomelt PA 657 is a high-performance, thermoplastic polyamide designed specifically for low-pressure moulding (LPM).

Unlike traditional potting epoxies that require long cure times and housings, this hot-melt material is injected at low pressure to encapsulate components directly, forming its own “housing” as it cools.

The primary advantage of PA 657 is its low melt viscosity, which allows it to flow around extremely fragile components—such as fine wires, delicate sensors, and micro-switches—without causing mechanical damage. Once solidified, it provides a resilient, watertight barrier with exceptional cold-temperature flexibility and adhesion to diverse substrates including FR4, metals, Acrylonitrile Butadiene Styrene (ABS), and Polycarbonate (PC).