Cho-Bond 584-29 (10g)

SKU: CH5714

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  • Two component.
  • Excellent conductivity – 0.002 ohm-cm.
  • Fast heat cure – increases the throughput while minimizing the equipment downtime.
  • Thin paste.
  • Silver filler.
  • Epoxy adhesive/hardener.
International Shipping Notice Pricing and online ordering are unavailable for this product as you are outside the UK, please request a quote or contact sales@hitek-ltd.co.uk for assistance.
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Cho-Bond 0584-29 (10g) is a two-component highly conductive adhesive, designed for precise electrical bonding requirements, it is an excellent EMI shield.

 

  • Technical Datasheet

    PDF - 1 MB

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    Material Safety Datasheet Part A

    PDF - 641 KB

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    Material Safety Datasheet Part B

    PDF - 472 KB

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  • Weight 0.22 kg
    Part Number

    50-03-0584-0029

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