Cho-Bond 1030 & Primer 1086 (113g kit)
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Cho-Bond 1030 & Primer 1086 (113g kit)

SKU: CH5703

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  • Silver plated copper filler.
  • Good conductivity – 0.050 ohm-cm.
  • Medium paste.
  • Easy to use – no weighing or mixing required.
  • Moisture cure silicone.
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Cho-Bond 1030 & Primer 1086 (113g kit) is a silver plated copper filled, electrically conductive silicone. It is easy to use and designed to simplify the problem of bonding conductive silicone EMI gaskets to metal substrates. Supplied with Primer 1086.

  • Technical Datasheet

    PDF - 2 MB

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    Material Safety Datasheet

    PDF - 405 KB

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  • Weight 0.35 kg
    Part Number

    50-02-1030-0000 + Primer 1086

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