Ablestik 24

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  • Two-Part
  • Flexible
  • Easy to Use
  • Room Temperature Cure
  • Designed to give thin bondlines
  • Strong bond between materials with different Coefficients of Thermal Expansion
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Ablestik 24 is a two-part non-conductive adhesive designed for use on most metals, ceramics and polystyrene. This room temperature curing epoxy adhesive is made for use where thin bond lines are wanted.

  • Weight N/A
    Variant

    Part A, Part A and B

    Weight

    1kg, 250g, 782g

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