Ablestik 2332-17

Ablestik 2332-17 is a high-performance, one-part, epoxy adhesive designed for versatile assembly bonding across a vast array of substrates. This solvent-free formulation is particularly notable for its ability to develop high bond strength even on challenging surfaces such as oily steel, copper, nickel, aluminium, and rigid plastics like Fiberglass Reinforced Plastic (FRP). Because it is a single-component system, it requires no mixing, significantly reducing the risk of ratio errors and simplifying the production workflow.

A key advantage of this adhesive is its flexible curing profile; it achieves its maximum strength at temperatures as low as 100°C to 130°C and can even be cured within standard industrial paint ovens. Once cured, the material exhibits a unique combination of low-temperature flexibility and high shear strength. This robustness is maintained over a broad temperature range, with an operating limit of 150°C, making it suitable for demanding industrial and electronic environments.

With a viscosity of 75,000 mPa·s, the adhesive provides excellent stability during application. It is electrically non-conductive, offering a volume resistivity at 25ºC of 6×1014 ohm-cm, which ensures safety in electronic assemblies. For optimal results, the product should be stored between 0°C and 8°C. Whether used for heavy-duty industrial bonding or sensitive electronics assembly, Ablestik 2332-17 provides a reliable interface with minimal linear shrinkage and a glass transition temperature of 87°C.