Permabond ET5453 (100g)

Permabond ET5453 is a two-part, silver-copper epoxy paste designed specifically for applications requiring high electrical conductivity. It is an ideal solution for electronic assemblies, EMI/RFI shielding, and cold soldering, where a reliable electrical path must be established between a wide variety of substrates.

With excellent thermal conductivity and strong adhesion to diverse materials, Permabond ET5453 provides a durable bond that cures at room temperature. This 9:1 mixable adhesive offers a user-friendly pot life, ensuring sufficient working time for intricate manual applications or high-precision industrial repairs.

ET5453 is ideal for grounding and thermal management as it offers a volume resistivity of 0.003 Ω-cm and a maximum gap fill of 2mm. It reaches handling strength in 2-3 hours at 23°C, with a full structural cure achieved within 48 hours.