LOCTITE ABLESTIK 56C

Ablestik 56C is a two-component, silver-filled, epoxy adhesive designed to create reliable electrical connections where soldering is not feasible. This conductive material is widely used for bonding components to heat-sensitive substrates, such as conductive plastics, glass, and ceramics. Its high silver loading ensures excellent electrical conductivity and high bond strength, while its “no-flow” characteristics prevent the adhesive from migrating during application, making it ideal for precision electronic assembly.

In its uncured form, the resin is a thick, silver-coloured paste with a high density of approximately 3.15 g/cm³. While it is compatible with a variety of catalysts to suit different manufacturing requirements, the base resin is engineered for long-term stability, offering a shelf life of up to one year when stored properly. Depending on the specific catalyst selected, the material can be adapted for different mix ratios and cure profiles, including options for lower temperature processing or faster throughput in automated production lines.

Once the selected curing cycle is complete, the adhesive provides a robust thermal and electrical bridge with a thermal conductivity of 3.0 W/m-K. It is capable of maintaining its mechanical and electrical integrity across a wide operating temperature range, typically from –60°C to +120°C. Furthermore, the cured material is recognized for its high purity and low outgassing properties, meeting stringent standards for use in sensitive aerospace and high-reliability industrial electronics where contamination must be strictly controlled.