Cho-Bond 584-208
SKU: CH5717A
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- Part Name: 50-00-0584-0208
- Fast heat cure, increases throughput, minimizes equipment downtime
- Good conductivity 0.002 ohm-cm
- Minimal shrinkage
- 60 minute working life
- Works well over wide temperature range
International Shipping Notice
Pricing and online ordering are unavailable for this product as you are outside the UK, please request a quote or contact sales@hitek-ltd.co.uk for assistance.
CHO-BOND 208 is a special two-part epoxy. When mixed in the correct ratio, these components trigger a chemical reaction that results in a robust and permanent bond. This two-part system ensures a more complete cure, maximizing the bond’s strength and electrical conductivity. It also boasts remarkable electrical conductivity. This means it can not only physically hold your components together but also allow electrical current to flow through the bond seamlessly.
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Weight 0.2 kg -
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