Cho-Bond 1038
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- One component.
- Silver plated copper filler.
- Excellent conductivity – 0.010 ohm-cm.
- Medium paste.
- Easy to use – no weighing or mixing required.
- Moisture cure silicone.
CHO-BOND 1038 is a silver-plated copper filled, one-component conductive silicone designed for EMI shielding and electrical grounding. It’s used as a fillet, gap filler, and seam sealant on electrical enclosures and provides a robust conductive and environmental seal.
This moisture-cure silicone polymer system allows it to cure to the touch in 24 hours, with full cure achieved in one week. It has a 30-minute working life and requires no pressure during curing. The product is a non-corrosive cure mechanism, meaning no corrosive by-products are generated during curing, which could damage the substrate.
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Weight N/A Part Number 50-01-1038-0000 + Primer 1086, 50-02-1038-0000 + Primer 1086
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