Ablestik 24
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- Two-Part
- Flexible
- Easy to Use
- Room Temperature Cure
- Designed to give thin bondlines
- Strong bond between materials with different Coefficients of Thermal Expansion
International Shipping Notice
Pricing and online ordering are unavailable for this product as you are outside the UK, please request a quote or contact sales@hitek-ltd.co.uk for assistance.
Ablestik 24 is a two-part non-conductive adhesive designed for use on most metals, ceramics and polystyrene. This room temperature curing epoxy adhesive is made for use where thin bond lines are wanted.
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Weight N/A Variant Part A, Part A and B
Weight 1kg, 250g, 782g
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