Out of stock

Ablestik 104 MOD – 2

SKU: AB104MOD2

Request for quote

  • Electrically conductive.
  • Low temperature cure.
  • High bond strength.
  • Low electrical resistance.
  • No-flow characteristics.
  • Two component.
  • Long shelf life at room temperature.
  • Passes NASA outgassing.
International Shipping Notice Pricing and online ordering are unavailable for this product as you are outside the UK, please request a quote or contact sales@hitek-ltd.co.uk for assistance.
Add to Quote

Ablestik 104 MOD2 is a high-performance, two-component epoxy adhesive engineered for structural bonding in extreme thermal environments.

It is a 100% solids system, containing no solvents or volatile organic compounds (VOCs). This makes it suitable for bonding a vast array of both porous and non-porous substrates, including stainless steel, carbon steel, brass, ceramics, glass, and thermoset plastics.

The standout feature of Ablestik 104 MOD2 is its exceptional thermal ceiling. While it maintains a continuous service temperature of 230ยฐC, it is uniquely capable of withstanding intermittent exposure up to 290ยฐC (554ยฐF). This makes it an essential choice for heavy-duty industrial assemblies, aerospace components, and automotive engine-room applications where standard epoxies would fail.

  • Select your product options above to see the downloads available.

  • Weight N/A
    Variant

    Part A, Part B

  • Reviews

    There are no reviews yet.

    Be the first to review “Ablestik 104 MOD – 2”