Cho-Form 5528 (850G)

CHO-FORM® 5528 (850G) is a moisture-cure silicone form-in-place (FIP) EMI gasket. This one-component material is highly compressible, allowing for substantial space savings and accommodating flange widths as narrow as 0.025 inches (0.64 mm). Featuring a silver/copper (Ag/Cu) particle filler, it provides high-performance electromagnetic interference shielding with a shielding effectiveness greater than 70 dB. It also offers low closure force sealing, reducing stress on components, and excellent adhesion to common housing substrates. The gasket fully cures in approximately 24 hours at 50% relative humidity. It is ideal for a range of applications, including military and aerospace electronics enclosures, automotive sensor housings, and telecom infrastructure.