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Glob-Top Encapsulants

Glob-Top Encapsulants

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Glob-Top Encapsulants – These encapsulations protect fragile semiconductor die and wire bonds. They can be placed over chips to protect them from harmful environments, provide structural reinforcement, or even act as a barrier layer against tampering.

Applications

Glob top compounds are ideal for encapsulating wire bonds and semiconductor chips. They minimise thermal mismatch with components and substrates, offer protection against moisture and provide mechanical support.

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Products

Eccobond 50300 HT

Eccobond 50300 LV

Eccobond 50500 1 (formerly Stycast 50500 1)

Applications include:

  • Transistors

  • System in package (SIP) devices

  • Protecting your IP

  • Chip-on-board applications

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