Form-in-Place (FIP) Gasketing Services
High-precision Form-in-Place
In modern electronic packaging, shielding and sealing often require more precision than a traditional die-cut gasket can provide. We offer a high-precision Form-in-Place (FIP) gasketing service designed for applications where space is at a premium and geometries can be complex. By utilising Parker Chomerics’ Cho-form® (Conductive) and ParPHorm® (Non-Conductive) materials, we provide automated dispensing solutions that cater to the rigorous demands of the electronics, automotive, and aerospace industries.
These materials are engineered to conform to intricate housing shapes, creating a highly reliable environmental or EMI seal. This process is ideal for multi-compartment enclosures where manual gasket placement would be labour-intensive, costly, or technically impossible.
Technical Materials: Cho-form® and ParPHorm®
Our FIP service utilises the industry-standard materials from Parker Chomerics to ensure long-term performance integrity:
- Cho-form® (Conductive): This material is a robotically dispensed EMI shielding elastomer. It is filled with conductive particles (such as Silver-Copper or Nickel-Graphite) to provide excellent shielding effectiveness while requiring very little compression force.
- ParPHorm® (Non-Conductive): For applications that require environmental sealing without the need for EMI shielding, ParPHorm provides a high-quality silicone or fluorosilicone barrier. It is exceptionally resilient and resistant to compression set, ensuring a watertight seal even after repeated opening and closing of the enclosure.
Critical Design Considerations for FIP
To ensure the longevity and performance of a Form-in-Place gasket, several mechanical factors must be addressed during the design phase. Our experienced technicians work closely with your engineers to optimise these parameters:
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We typically recommend a minimum gasket bead height of 0.8mm to 1.0mm. While the maximum height for a singular bead is roughly 1.6mm, greater heights can be achieved through a specialised “bead-on-bead” dispensing technique. However, height-to-width ratios must be carefully managed to prevent the bead from “slumping” or becoming unstable during the curing process.
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To achieve a high-quality, durable seal, we recommend providing 0.2mm to 0.3mm of clearance within the metal chassis. This allows the bead to “wet” the surface correctly and sit securely within its designated path.
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For maximum durability, a U-shaped groove is the preferred landing surface for the FIP bead. This geometry provides lateral support to the gasket, significantly increasing its lifespan and resistance to shear forces. While HITEK can dispense gaskets onto flat surfaces or etched metalwork, we cannot guarantee the same level of long-term adhesion and longevity as a grooved interface.
For a deeper dive into these specifications, please refer to the Parker Chomerics Gasket Design Considerations PDF, which outlines the physics of compression and material displacement.
The Strategic Benefits of FIP Technology
- Programmable Design: Our CNC-controlled dispensing machine can follow paths, including 3D profiles and narrow walls, allowing for total design freedom.
- Superior Watertight Sealing: Because the material is dispensed as a liquid and cured in situ, it creates an intimate bond with the substrate, effectively preventing moisture ingress.
- High Shielding Effectiveness: Conductive FIP gaskets provide seamless EMI protection with no gaps or “seams,” which are often the weak points in traditional gasket assemblies.
- Reduced Total Cost of Ownership: By automating the gasket application, we eliminate the need for manual assembly, reduce scrap rates, and speed up the overall production cycle.
Partner with Our FIP Specialists
If you are looking to integrate automated gasketing into your next project, our team is ready to assist. We can provide guidance on material selection, bead paths, and housing modifications to ensure your electronics remain protected in even the harshest environments.
Contact our team
Ready to start your FIP project? Fill out the form below with your enclosure specifications, and one of our FIP specialists will contact you to review your enquiry and provide a technical assessment.
HITEK Electronic Materials Ltd, 15 Wentworth Road, South Park Industrial Estate, Scunthorpe, North Lincolnshire, DN17 2AX