Thermal Gap Fillers

Thermal interface materials fill air gaps between hot components and heat sinks or metal chassis. They are available as cut shape pads and dispensable gels.

Products

Parker Chomerics Pads & Gels

Select the product name to access its datasheet.

Bergquist Pads & Gels

Select the product name to access its datasheet.

Applications

Thermally conductive gap filler sheets and pads offer excellent thermal properties and high conformability at low clamping forces.

 

Key features and benefits include:

  • High conformability

  • Ultra-low deflection force

  • High tack surface to reduce contact resistance

  • Minimal component stress

  • Reduced 'hot spots' on printed circuit board

  • Thicker pads can improve vibration dampening

  • Can 'blanket' multiple components

Applications include:

  • Telecommunications equipment

  • Consumer electronics

  • Automotive electronics (ECUs)

  • LEDs and lighting

  • Power conversion

  • Power semiconductors

  • Desktop computers, laptops and servers

  • Handheld devices

  • Memory modules

  • Vibration dampening

Dispensable gap fillers are highly conformable, pre-cured, single-component compounds that feature a cross-linked gel structure which provides long-term thermal stability and reliability.

 

Key features and benefits include:

  • One-component dispensable (eliminates multiple part sizes/numbers) 

    • Aids in automation

  • Fully cured

    • Requires no refrigeration

    • No mixing or additional curing

    • No settling in storage

  • Highly conformable at low pressure

    • Applies minimal stress, making it effective for delicate components

  • High surface tack

Applications include:

  • Automotive electronic control units (engine control, transmission control and braking/traction control)

  • Power conversion equipment

  • Power supplies and uninterruptible power supplies

  • Power semiconductors

  • MOSFET arrays with common heat sinks

  • Televisions and consumer electronics

Frequently Asked Questions

What is bulk thermal conductivity and how is it determined?

Bulk thermal conductivity is an intrinsic property of any homogeneous material. To measure bulk thermal conductivity, the contact resistance must be subtracted from the individual ASTM D5470 thermal resistance measurements. This is achieved by measuring thermal impedance (resistance) of the material at multiple thicknesses and generating a straight-line plot. The y-intercept of that plot is the total contact resistance and the slope can be converted to bulk thermal conductivity.

Why is apparent thermal conductivity useful?

A material can have a very high intrinsic bulk thermal conductivity but be outperformed by a material of lower bulk conductivity that is softer and more conformable. Measuring apparent (effective) thermal conductivity can help better identify real world performance of a thermal interface material in many cases.

Is there a correlation between apparent and bulk thermal conductivity?

Generally, there is no 'go-to' correction factor or simple equation to 'convert' from apparent to bulk conductivity. The contact resistance can vary widely across different thermal interface materials and there are also many other factors to consider including pressure during test, flatness and thickness uniformity of the sample, contact area, etc.

What are the dispensing patterns when using thermal pastes/gels?

Please see Parker Chomerics' Dispensing Guide.

HITEK Electronic Materials Ltd

15 Wentworth Road, South Park Industrial Estate, Scunthorpe, DN17 2AX North Lincolnshire, United Kingdom

Phone Number: +44 (0)1724 851678    Email Address: sales@hitek-ltd.co.uk

Company Number: 01926845     VAT Number: GB365016468     EORI Number: GB365016468000

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