Thermal Attachment Tapes
These double-sided adhesive tapes provide an effective thermal interface between electronic components and heat sinks.
Parker Chomerics' Thermally Conductive Adhesive Tapes
Bergquist Bond-Ply Adhesives
Bond-Ply TBP 850
Bond-Ply TBP 400P
Bond-Ply TBP 800
Bond-Ply TBP 1400LMS-HD
Bond-Ply TBP 400
Thermal interface tapes provide exceptional bonding properties between electronic components and heat sinks, eliminating the need for mechanical fasteners.
• Offered in various forms to provide thermal, dielectric and flame retardant properties
• Offered in custom die-cut configurations to suit a variety of applications
• Eliminates the need for mechanical attachment (e.g. screws, clips, rivets and fasteners)
• Proven reliability under various mechanical, thermal and environmental stresses
• Embossed version available
• UL recognised V-0 flammability
• No curing required, unlike epoxy or acrylic preforms or liquid systems
• Easily re-workable
• Mount heat sinks to components dissipating < ~25 W
• Attach heat sinks to PC (e.g. graphics processors)
• Heat sink attachment to motor control processors
• Telecommunication infrastructure components
Frequently Asked Questions
What test method does Parker Chomerics use to characterise thermal interface material (TIM) performance?
Their standard test method is ASTM D5470.
What is the output of ASTM D5470 thermal conductivity test?
ASTM D5470 measures thermal impedance (resistance) of a flat disk-shaped specimen or controlled volume of a liquid TIM between two flat polished calorimeter surfaces under controlled load.
What is apparent thermal conductivity?
Apparent thermal conductivity is a calculated value that uses the thermal impedance (resistance) measured from ASTM D5470 and the sample thickness to calculate a thermal conductivity value. This value is influenced by how effectively the sample contacts (or 'wets out' if a dispensable) the calorimeter surfaces. The thermal resistance at the interface between the sample and the probes is called contact resistance. Contact resistance adds to the overall thermal impedance and may produce a lower measurement than bulk thermal conductivity.
Is there a recommended surface roughness?
As a general rule, increased surface roughness will create a larger surface area available for wetting. For vertical applications, increased surface roughness will provide an greater resistance to slide. Generally, increasing the shot size, contact area and surface roughness will aid in slide resistance of the material. Surface roughness of N8 or rougher is recommended.
What materials do you recommend where applications require thin bondline thickness from a thermally conductive material?
This type of application would require a smooth/flat surface roughness. For this we recommend Ablefilm, Thermattach tapes, Cho-Therm, thermal greases or pastes/gels.