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THERM-A-FORM thermally conductive compounds are dispensable form-in-place materials used for filling, potting, sealing and encapsulating applications in heat transfer solutions. With highlighted properties such as conformability and low modulus', THERM-A-FORM materials have an array of beneficial properties to optimise solutions.
Please consider the following for heat transfer applications:
THERM-A-FORM™ 1641, previously known as CHO-THERM 1641 - is a single-component, thermally conductive adhesive/sealant/potting compound which is also electrically insulating. THERM-A-FORM™ 1641 is silicone based, it vulcanises at room temperature, offers high thermal performance and a wide operating temperature range. Primer 1086 can be used in conjunction with THERM-A-FORM™ 1641 to improve adhesion.
THERM-A-FORM™ T642 is a two-part silicone encapsulant which provides high thermal performance with flexibility; THERM-A-FORM™ T642 is ideal for numerous component-level heat transfer applications. When Part A and B are combined they produce a flexible, low modulus rubber ideal for under filling. THERM-A-FORM™ T642 also has low outgassing properties.
THERM-A-FORM™ T644 is a two-part, soft thermal interface compound with a very low modulus designed to transfer heat away from delicate electronic components. THERM-A-FORM™ T644 also offers a long pot life at 20°C for 6 hours. THERM-A-FORM™ T644's low modulus allows it to coform to irregular shapes without excessive force on components.
THERM-A-FORM™ T647, a two-component that provides superior thermal performance, with a thermal conductivity of 3W/m-K, as well as good flowing properties. Even with it's superior thermal properties THERM-A-FORM T647 maintains a low modulus and its good flow means it can maintain intimate contact with components even those within complex geometries.
If you need help with your application please contact HITEK Electronic Materials Ltd. Contact Us.
Speak to an expert +44 (0)1724 851678
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