BERGQUIST GAP PAD TGP 18000SF

Description

BERGQUIST GAP PAD TGP 18000SF is a gap filling material with a thermal conductivity rating of 18 W/m-K. It’s specifically formulated for high-performance applications that need silicone-free solutions. This material delivers outstanding thermal performance under standard pressures thanks to its unique filler composition. 18000SF has properties such as low bleed and outgassing as well as ceramic fillers in elastomer matrix. This product can come with a protective layer of PSA

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