Cho-Bond 0584-29 (10g)

Available for RFQ

  • Two component
  • Excellent conductivity – 0.002 ohm-cm
  • Fast heat cure – increases the throughput while minimizing the equipment downtime
  • Thin paste
  • Silver filler
  • Epoxy adhesive/hardener

 

Due to you being outside the UK we cannot allow you to purchase Dangerous Goods, Please contact sales@hitek-ltd.co.uk if you require support.

Description

Cho-Bond 584-29 is a two-component highly conductive adhesive, designed for precise electrical bonding requirements, it is an excellent EMI shield.

 

Datasheets

Additional information

Weight 0.02 kg
Part Number

50-03-0584-0029

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