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Liqui Form TLF LF 2000

Liquid formable, thermally conductive compound which is highly conformable and exhibits minimal component stress.

LF 2000 is supplied by HITEK and should be considered for applications where the need for stability and ease of use are essential but also minimal component stress during assembly is an integral factor. LF 2000 offers low volumetric expansion and high thermal performance as wells as superb mechanincal and chemical resistance (even at high temperatures). 

This liquid formable, thermally conductive compound is thixotropic and naturally tacky meaning it forms around the sensitive components and stays in place during assembly. LF 2000 is highly conformable, offers reliable long term performance and provides ease of use and storage as it doesn't need to be cured, mixed or refrigerated. It can be used at continuous temperatures ranging from -60 to 200°C, comes in a range of sizes (30cc, 600cc cartridges and 5 galon pails) to tailor to individual demands and can be supplied in two forms with either no spacer beads or 0.007" spacer beads dependant on whether a lower or higher viscosity is required.

Features and Benefits:

  • High Thermal Conductivity (2.0 W/mK)
  • Very low force exhibited on components 
  • Low volumetric expansion
  • Excellent chemical & mechanical stability 
  • No curing, mixing or refrigeration required
  • Highly conformable and shear thinning
  • Reliable long term performance
  • Thixotropic and naturally tacky

Typical Applications include:

Demanding applications where stability, ease of use and low component stress during assembly is required, bare die to heat spreader lids, filling various gaps between heat-generating devices to heat sinks and housings, BGAs, PGA's and PPGA's. 

For the full datasheet on this product please see the downloads section below and if you need any more information on the product please contact HITEK on +44 (0)1724 851678

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