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Injection Moulding Thermoplastic Material offering high magnetic and electrical loss properties for frequency solutions ranging from 600MHz to 110GHz, with a wide range of flexible and rigid thermoplastic compounds and absorptive fillers, offered as moulded parts or in pellet form. These are ideal for on board interference problems, waveguide terminations and sub-enclosures and are also available as thin extruded sheets.
Thermoplastics are blended with fillers by ARC Technologies to create solutions to interference problems. They can be used in a cast, moulded, extruded or pellet form. In the binder ARC Technologies can compound various fillers; usually carbon, ferrite or iron particles to achieve the desired absorption or conductivity to solve the problem. By combining a binder which meets the product requirements and with the fillers that also meet the electrical and magnetic properties, a complete solution can be formed.
Thermoplastics are effective as parts can be moulded to fit over the IC’s, or extruded to wrap and cover a product or cable or are sold as in pellet form, to enable the end user to mould/extrude their own product. The use of fillers allows ARC Technologies to alter the end product for narrow or broadband applications.
Injection moulding benefits include:- lower cost materials for energy management, engineered materials for the toughest environment, conformal shapes to reduce labour costs and single piece cavity solutions which will reduce time and be less tricky when working with the pellets. Thermoplastics can be supplied with preformed antenna loads to suit every specification.
For custom specifications and sizes or if you need help with your application please contact HITEK Electronic Materials Ltd. Contact Us.
Speak to an expert +44 (0)1724 851678