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A naturally tacky thermally conductive phase change material

HI FLOW THF 3000UT is now supported by HITEK. It is a naturally tacky, thermally conductive phase change material which is supplied in a user-friendly tabulated pad form. In the application the material undergoes a phase change softening, starting near 52°C. The phase change softening feature improves handling characteristics prior to a facilitated assembly. At application temperatures and pressures, HI FLOW THF 3000UT wets out the thermal interfaces resulting in very low thermal impedance. The thermal performance of this product is comparable to the best thermal greases. HI FLOW THF 3000UT is provided at a consistent thickness to ensure reliable performance and it can be applied in high volumes to the target surface via low pressure from a roller or manual application.

 Features and Benefits:

• Thermal impedance: 0.05°C-in2/W (@25 psi)
• High thermal conductivity: 3.0 W/mK
• Phase change softening temp 52°C 
• Naturally tacky
• Tabulated for ease of assembly

Typical Applications include:

Processor lid to heat sink, processor die to lid or heat sink and FBDIMM to heat spreader.

For the full datasheet on this product please see the downloads section below and if you need any more information on the product or to request a quote please contact HITEK on +44 (0)1724 851678



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