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Henkel Gap Fillers

Thermally conductive, liquid gap filling materials

HITEK are now suppliers of the Henkel gap filler range. These are thermally conductive, liquid gap filling materials. These materials provide the user with a number of different benefits including: 

  • Excellent Conformability to Intricate Geometries - Liquid Gap Filler materials are able to conform to intricate topographies, including multi-level surfaces. Due to its increased mobility prior to cure, Gap Filler can fill small air voids, crevices, and holes, reducing overall thermal resistance to the heat generating device.
  • Single Solution for Multiple Applications - Unlike pre-formed gap filling materials, the liquid approach offers infinite thickness options and removes the need for specific pad thicknesses or die-cut shapes for individual applications.
  • Efficient Material Usage - Manual or semiautomatic dispensing tools can be used to apply material directly to the target surface, resulting in effective use of material with minimal waste. Further maximization of material usage can be achieved with implementation of automated dispensing equipment, which allows for precise material placement and reduces the application time of the material.
  • Customizable Flow Characteristics - Although Gap Fillers are designed to flow easily under minimal pressure, they are thixotropic in nature which helps the material remain in place after dispensing and prior to cure. Henkel Gap Filler offerings include a range of rheological characteristics and can be tailored to meet     customer-specific flow requirements from self-levelling to highly thixotropic materials that maintain their form as dispensed.

The range of materials includes:

• Gap Filler TGF 1000SR - is a two-part, thermally conductive, liquid gap filling material that features superior slump resistance.

• Gap Filler TGF 1400SL - is a two-part, thermally conductive, silicone based, liquid gap filling material.

• Gap Filler TGF 1400GEL - is a two-part, high performance, thermally conductive liquid gap filling material.

• Gap Filler TGF 1500LVO - is a two-part, high performance, thermally conductive, liquid gap filling material. This material offers the high temperature resistance.

• Gap Filler TGF 3500LVO - is a two-part, high thermal conductivity, liquid gap filling material. This material offers the mechanical property benefits of a silicone material with the additional feature of low outgassing.

• Gap Filler TGF 3600 - is the technology leader in thermally conductive, liquid gap filling materials, featuring ultra-high thermal performance and superior softness.

• Gap Filler TGF 4000 - is a two-part, high performance, thermally conductive, liquid gap filling material. The mixed material will cure at room temperature and can be accelerated with the addition of heat.

• LIQUI FORM TLF LF3500 - is a high conductivity gel thermal interface material designed for demanding applications that require a balance between dispensability and low component stress during assembly and also in the application.

For the full datasheet on any of these products please click on the links above and there is a download section with it along with further product information and if you do need any more information on the product or to request a quote please contact HITEK on +44 (0)1724 851678

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