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The THERM-A-GAP® range of dispensable thermal gap filler gels are form-stable, general user material, which provide good to outstanding thermal performance.
Since they are fully cured these dispensable gels diminish time consuming and costly factors. These materials deflect without difficulty under low deflection force - minimal stress acts upon components - decreasing the number of component failures. THERM-A-GAP dispensable gels have proven their capabilities with years of experience in demanding applications. The following dispensable gels can be considered:
The THERM-A-GAP T63X series are conformable, single component compounds - they exhibit minimal stress on fragile components and are highly conformable even at low pressures - the THERM-A-GAP T63X series is ideal for filling variable gaps between multiple components and a collective heat sink. Typical applications include; engine and transmission control modules, memory modules, power conversion equipment, power supplies and uninterruptible power supplies, MOFSET arrays with common heat sinks, consumer electronics and voltage regulators. They exhibit less stress on components even when compared to the softest thermal gap filler pads. Since the THERM-A-GAP T63X series is already fully cured there is no settling in storage. The THERM-A-GAP T63X series is suitable for gap sizes ranging from 0.12mm to 2.54mm [0.05" to 0.100"], have an operating temperature ranging from -55ºC to 200ºC and are RoHS compliant.
THERM-A-GAP T630 is a general purpose material which has proven it's worth with years of use in high volume automotive applications. THERM-A-GAP T630 offers good thermal performance (0.7 W/m-K) and only requires a low deflection force meaning a minute amount of stress is exerted upon delicate components. There is another version with the same thermal, physical and electrical properties - known as THERM-A-GAP T630G. THERM-A-GAP T630G differs in that it contains glass beads compression stops, which are 0.25mm (0.01") thick, to improve electrical isolation. THERM-A-GAP T630/T630G has a UL94-V0 flammability rating also.
THERM-A-GAP T635 offers better thermal performance, than that of T630/G, with a thermal conductivity of 1.7 W/m-K. THERM-A-GAP T635 is conformable at low pressures meaning it only requires a low deflection force and exerts a miniscule amount of stress upon components (lower than that of even the softest gap filler pads).
THERM-A-GAP T636 has the greatest thermal performance out of the T63X series, with a thermal conductivity of 2.4 W/m-K. THERM-A-GAP T636's excellent thermal performance ensures that it can solve demanding heat transfer issues and its conformability, even at low pressures, means it only requires a low deflection force and exerts a miniscule amount of stress upon components.
THERM-A-GAP Gel 8010 is a low thermal impedance gel, with a superior thermal conductivity of 3.0W/m-K that has proven its long term reliability. THERM-A-GAP Gel 8010 should be used as a thin bondline gel (approximately 2-10 mils/ 0.002-0.010") and is stencil printable with no pump out. THERM-A-GAP Gel 8010 excels in high-volume dispensing applications and can be considered for applications such as automotive electronic units, microprocessors/ graphics processors, semi-conductors and power supplies. Gel 8010's low thermal impedance at thin and thick gaps allows the use of common heat spreaders. THERM-A-GAP Gel 8010 is also resilient against extreme temperature cycling, shock and vibration.
THERM-A-GAP Gel 30 provides outstanding thermal performance, with a thermal conductivity of 3.5W/m-K, it offers excellent performance to price. THERM-A-GAP Gel 30 accommodates a variety of bond line thicknesses, it has been successful when applied as a filler in a range of different gap thicknesses and can be suited for automated, high-volume dispensing. THERM-A-GAP Gel 30 is also resilient against extreme temperature cycling, shock and vibration. There is another version, with the same thermal, physical and electrical properties, known as THERM-A-GAP Gel 30G. THERM-A-GAP Gel 30G differs in that it contains glass beads compression stops, which are 0.25mm (0.01") thick, to improve electrical isolation.
There are other materials in the CHO-THERM® range that offer other features. If you need help with your application please contact HITEK Electronic Materials Ltd. Contact Us.
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