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THERM-A-FORM - form in place, thermal compounds produced by Chomerics - comes in cost-effective versions with a multitude of uses. These thermal compounds are used in heat transfer applications for cooling electronic components and are supplied as liquid reactive components and are available in a range of sizes for both manual and pneumatic dispensing.
Please consider the following for heat transfer applications:
THERM-A-FORM™ 1642 - previously known as CHO-FORM® 1642 - is general duty, thermally conductive sealant/caulk/adhesive/potting compound that is recommended for very thick applications and low humidity conditions. THERM-A-FORM™ 1642 is a two-component product that does not require atmospheric water to cure. THERM-A-FORM™ 1642 provides an economical thermal solution which combines the features of silicone and ceramics. THERM-A-FORM™ 1642 can also be bonded permanently by the addition of primer 1087.
THERM-A-FORM™ T646 is a commercial grade thermal interface compound, consisting of two components, it offers high thermal performance at an economical price. THERM-A-FORM™ T646 is ideal for heat transfer applications in electronic component cooling and transferring heat away from PC boards, metal enclosures and chassis. THERM-A-FORM™ T646 provides an outstanding combination of high thermal conductivity, low cost and ease of use.
If you need help with your application please contact HITEK Electronic Materials Ltd. Contact Us.
Speak to an expert +44 (0)1724 851678
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