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Cost-Effective Thermal Compounds

Thermal compounds for general use purposes offering ease of application, high thermal performance and cost-effectiveness.

THERM-A-FORM - form in place, thermal compounds produced by Chomerics - comes in cost-effective versions with a multitude of uses. These thermal compounds are used in heat transfer applications for cooling electronic components and are supplied as liquid reactive components and are available in a range of sizes for both manual and pneumatic dispensing.

Please consider the following for heat transfer applications:

THERM-A-FORM™ 1642 - previously known as CHO-FORM® 1642 - is general duty, thermally conductive sealant/caulk/adhesive/potting compound that is recommended for very thick applications and low humidity conditions. THERM-A-FORM™ 1642 is a two-component product that does not require atmospheric water to cure. THERM-A-FORM™ 1642 provides an economical thermal solution which combines the features of silicone and ceramics.  THERM-A-FORM™ 1642 can also be bonded permanently by the addition of primer 1087.

THERM-A-FORM™ T646 is a commercial grade thermal interface compound, consisting of two components, it offers high thermal performance at an economical price. THERM-A-FORM™ T646 is ideal for heat transfer applications in electronic component cooling and transferring heat away from PC boards, metal enclosures and chassis. THERM-A-FORM™ T646 provides an outstanding combination of high thermal conductivity, low cost and ease of use.

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Tailored Solutions 

If you need help with your application please contact HITEK Electronic Materials Ltd. Contact Us.

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