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Conformable Thermal Gap Filler Pads

Providing excellent thermal properties and the highest conformability at low clamping forces.

THERM-A-GAP® HCS10 and the THERM-A-GAP® 5XX series have excellent thermal properties and are highly conformable. These thermal gap fillers provide ultra-low deflection forces, high thermal conductivity and high tack surface which reduces contact resistance. 

THERM-A-GAP® HCS10 and the THERM-A-GAP® 5XX series are typically found in applications such as telecommunications, consumer electronics, automotive electronics (ECU's), LED's, lighting, power conversion, desktop computers, laptops, handheld devices, memory modules and vibration dampening. More information on this range can be found below:

THERM-A-GAP® HCS10 is an economical thermal gap filler pad which provides the highest conformability alongside a high dielectric strength. THERM-A-GAP® HCS10 is available on a woven glass carrier (with no pressure sensitive adhesive) or an aluminium foil; the latter comes with a very strong acrylic pressure sensitive adhesive for permanent adherence to cold surfaces. THERM-A-GAP® HCS10 has a thermal conductivity value of 1.0W/m-K (at 25 psi), an operating temperature ranging from -55°C to 200°C and comes in an array of thicknesses ranging from 0.01 - 0.20 inches (0.25 - 5.0mm).

THERM-A-GAP® 569 provides an economical combination of thermal performance and conformability. THERM-A-GAP® 569 is available on a woven glass carrier (with no pressure sensitive adhesive), an aluminium foil (with a very strong acrylic pressure sensitive adhesive for permanent adherence to cold surfaces) or a PEN film carrier (a custom carrier composed of polyethylene-naphthalate). THERM-A-GAP® 569 has a thermal conductivity value of 1.5W/m-K (at 25 psi), an operating temperature ranging from -55°C to 200°C and comes in an array of thicknesses ranging from 0.01 - 0.20 inches (0.25 - 5.0mm).

THERM-A-GAP® 570 is ideal for moulding complex parts and vibration dampening. THERM-A-GAP® 570 is available on a woven glass carrier (with no pressure sensitive adhesive) or an aluminium foil; the latter comes with a very strong acrylic pressure sensitive adhesive for permanent adherence to cold surfaces. THERM-A-GAP® 570 has a thermal conductivity value of 1.5W/m-K (at 25 psi), an operating temperature ranging from -55°C to 200°C and comes in an array of thicknesses ranging from 0.02 - 0.20 inches (0.5 - 5.0mm). 

THERM-A-GAP® 579 provides an economical combination of thermal performance and conformability. THERM-A-GAP® 579 is available on a woven glass carrier (with no pressure sensitive adhesive), an aluminium foil (with a very strong acrylic pressure sensitive adhesive for permanent adherence to cold surfaces), a PEN film carrier (a custom carrier composed of polyethylene-naphthalate) or a thermally enhanced polyimide carrier. THERM-A-GAP® 579 has a thermal conductivity value of 3.0W/m-K (at 25 psi), an operating temperature ranging from -55°C to 200°C and comes in an array of thicknesses ranging from 0.01 - 0.20 inches (0.25 - 5.0mm).

THERM-A-GAP® 580 is ideal for moulding complex parts and vibration dampening. THERM-A-GAP® 580 is available on a woven glass carrier (with no pressure sensitive adhesive) or an aluminium foil; the latter comes with a very strong acrylic pressure sensitive adhesive for permanent adherence to cold surfaces. THERM-A-GAP® 580 has a thermal conductivity value of 3.0W/m-K (at 25 psi), an operating temperature ranging from -55°C to 200°C and comes in an array of thicknesses ranging from 0.02 - 0.20 inches (0.5 - 5.0mm). 

 

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Tailored Solutions

There are other materials in the CHO-THERM® range that offer other features. If you need help with your application please contact HITEK Electronic Materials Ltd. Contact Us.

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