HITEK offers a range of Compounds from our suppliers that are suitable for filling interfaces and for encapsulation. These include the Therm-a-Form® and Cho-Bond® products from Chomerics. Some of the Stycast®, Eccobond®, Amicon®, Ablefilm® and Abletherm® products from Emerson and Cuming.
If there is nothing suitable on this page please go to the EMC conductive compounds area where there are several electrically conductive compounds with high thermal conductivities listed
As with all applications the choice of thermal material used will be dependent on the nature of the application and the primary purpose of the product. The factors that should be taken into consideration are listed on the Thermal-Materials page.
For low volume applications please contact HITEK Electronic Materials Ltd to check availability of a particular product.
For advice or application help please contact HITEK Electronic Materials Ltd
CHO-THERM® 1641 one-part compound is formulated for sensitive electronic components in power supplies, medical instruments and motion control applications.
CHO-THERM® 1642 two-part adhesive/sealant/caulk/ potting compound provides higher thermal conductivity than 1641 material. It is formulated for thick applications and low humidity conditions.
THERM-A-FORM® - form-in-place materials are used for heat transfer applications in electronic component cooling. These flexible elastomer compounds minimize stress on components. They are available in a range of kit sizes for both manual and pneumatic dispensing.
THERM-A-FORM® T642 - 2-part silicone ideal for under filling
THERM-A-FORM® T644 - 2 part silicone compound, very soft