Thermal Gap Fillers
THERM-A-GAP® thermal interface materials fill air gaps between hot components and heat sinks or metal chassis. Their flexible, elastic nature allows them to blanket highly uneven surfaces. Heat is conducted away from separate components or entire PCBs into metal covers, frames or spreader plates.
The purpose of the gap filler in the joint is to replace the air gap with something that is at least 30 times more conductive than air and in intimate contact with both the surface of the component and the heat sink. When choosing the gap filler take account of the maximum pressure that the component can take along with the tolerance on the gap.
Need help with your application? Contact HITEK Electronic Materials Ltd.
THERM-A-GAP® G974 - has a high thermal conductivity of 4.0 W/m-K
THERM-A-GAP® A174 - materials for high volume, low cost applications
THERM-A-GAP® G174 - like A174 but with a fibreglass cloth carrier
THERM-A-GAP® A274 - materials can be molded to exact requirements
THERM-A-GAP® A574 - materials are ideal for heat flux typical of CPU
THERM-A-GAP® G574 - like A574 but with fibreglass cloth carrier
THERM-A-GAP® A5X0 - latest in soft thermally conductive gap fillers
THERM-A-GAP® T630 - form stable dispensable gap filler
Please contact HITEK Electronic Materials Ltd to confirm availability on the above products for small volume applications