HITEK Electronic Materials Ltd provides bespoke services to the electronics industry
Site last updated: Monday, June 2, 2008
Resin Systems
This section of the website covers some of the more common adhesives, encapsulants and circuit assembly materials available from HITEK.
In general the data is limited to the selector charts.
When choosing adhesives or encapsulants for an application some of the items that need to be taken into account are listed below. They are in no particular order as these vary significantly with the application. A good starting point/checklist are the application questionnaires. For more information on choosing adhesives or encapsulants please click here for questionnaires
- Lap shear strength
- Shore hardness
- Chemical resistance
- Water absorption
- Glass transition temperature Tg
- Mix ratio
- Viscosity
- Storage temperature
- Shipping condition (dry ice)
- Max Service temperature
- Cure temperature
- Volume resistivity
- Conductivity
- Die shear strength
- Cure time
- Min service temperature
- Thermal conductivity
- Abrasiveness
- Toxicity
- Flame retardance (UL rating)
- Colour
- Dielectric strength
- Dissipation factor
- Dielectric constant
- UV stability
- Colour
- High voltage isolation
- Packaging
- Handling