HITEK Electronic Materials Ltd provides bespoke services to the electronics industry
Site last updated: Monday, September 22, 2008
Materials
Therm-Attach
Therm-A-Gap
Compounds
Below is a list of things that should be considered when choosing the material they are not in any order of importance as that changes with the nature of the application.
If you would like further assistance with choosing a material or advice on your application please contact HITEK Electronic Materials Ltd.
- Thermal impedance
- Thermal Conductivity
- Size & tolerance of gap to be filled
- Heat flux density
- Total heat dissipation
- Surface quality
- Flatness
- Conformability
- Electrical isolation
- Humidity
- Corrosive atmosphere
- Flammability
- Safety agency approvals; UL, CSA, VDE, ISO, etc.
- Shock & vibration
- Cost
- Assembly method
- Repairability
- Mounting pressure
- Permanent attachment
- Manufacturing ease, convenience
- Reliability
- Cut through resistance
Thermal properties of common materials - approx values at room temperature
Thermal Theory - basic conduction theory applied to interface materials